Lanka Micro
Chip Quik, Inc.
Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Image | Part Number | Manufacturers | Description | Unit Price($) | Stock | |
|---|---|---|---|---|---|---|
|
IPC0108-S | Chip Quik, Inc. | QFN-20 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0117-S | Chip Quik, Inc. | QFN-14 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0037-S | Chip Quik, Inc. | QFN-12 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0094-S | Chip Quik, Inc. | POWERSSOP-38 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0118-S | Chip Quik, Inc. | QFN-100 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0093-S | Chip Quik, Inc. | POWERSSOP-32 STENCIL | 11.59 | 0 | Inquiry |
|
SMD2SW.020 4OZ | Chip Quik, Inc. | SOLDER WIRE 60/40 TIN/LEAD NO-CL | 10.93 | 6 | Inquiry |
|
SMDSW.031 4OZ | Chip Quik, Inc. | SOLDER WIRE NO-CLEAN 63/37 4OZ. | 9.7 | 16 | Inquiry |
|
SMD2SW.031 4OZ | Chip Quik, Inc. | SOLDER WIRE 60/40 TIN/LEAD NO-CL | 9.45 | 5 | Inquiry |
|
RASW.031 4OZ | Chip Quik, Inc. | SOLDER WIRE 63/37 TIN/LEAD ROSIN | 9.41 | 17 | Inquiry |
IPC0108-S
QFN-20 STENCIL
IPC0117-S
QFN-14 STENCIL
IPC0037-S
QFN-12 STENCIL
IPC0094-S
POWERSSOP-38 STENCIL
IPC0118-S
QFN-100 STENCIL
IPC0093-S
POWERSSOP-32 STENCIL
SMD2SW.020 4OZ
SOLDER WIRE 60/40 TIN/LEAD NO-CL
SMDSW.031 4OZ
SOLDER WIRE NO-CLEAN 63/37 4OZ.
SMD2SW.031 4OZ
SOLDER WIRE 60/40 TIN/LEAD NO-CL
RASW.031 4OZ
SOLDER WIRE 63/37 TIN/LEAD ROSIN