Product Parameter
- Series
- Bergpin®
- Packaging
- Bulk
- Insulation
- Non-Insulated
- Part Status
- Active
- Termination
- Solder
- Mounting Type
- Through Hole
- Terminal Type
- Single Post
- Contact Finish
- Gold
- Terminal Style
- Pin Retention
- Board Thickness
- 0.062" ~ 0.125" (1.57mm ~ 3.18mm)
- Flange Diameter
- -
- Contact Material
- Phosphor Bronze
- Insulation Color
- -
- Length - Overall
- 0.390" (9.91mm)
- Length - Above Flange
- -
- Length - Below Flange
- -
- Material - Insulation
- -
- Mounting Hole Diameter
- 0.034" ~ 0.036" (0.86mm ~ 0.91mm)
- Pin Size - Above Flange
- 0.025" (0.64mm) Square
- Pin Size - Below Flange
- 0.025" (0.64mm) Square
- Contact Finish Thickness
- 30.0µin (0.76µm)
Lanka Micro