Lanka Micro
Chip Quik, Inc.
Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Image | Part Number | Manufacturers | Description | Unit Price($) | Stock | |
|---|---|---|---|---|---|---|
|
SMD2SWLF.020 1OZ | Chip Quik, Inc. | LF SOLDER WIRE 99.3/0.7 TIN/COPP | 7.52 | 32 | Inquiry |
|
SMDSW.020 .4OZ | Chip Quik, Inc. | SOLDER WIRE POCKET PACK 63/37 TI | 5.99 | 86 | Inquiry |
|
SMD2SW.020 .4OZ | Chip Quik, Inc. | SOLDER WIRE POCKET PACK 60/40 TI | 5.89 | 76 | Inquiry |
|
PA0021-S | Chip Quik, Inc. | SSOP-30 STENCIL | 11.59 | 0 | Inquiry |
|
PA0016-S | Chip Quik, Inc. | SSOP-14 STENCIL | 11.59 | 0 | Inquiry |
|
PA0175-S | Chip Quik, Inc. | SOT-223-5 STENCIL | 11.59 | 0 | Inquiry |
|
PA0224-S | Chip Quik, Inc. | SOP-40 STENCIL | 11.59 | 0 | Inquiry |
|
PA0082-S | Chip Quik, Inc. | SC70-3/SOT-323 STENCIL | 11.59 | 0 | Inquiry |
|
PA0031-S | Chip Quik, Inc. | QSOP-28 STENCIL | 11.59 | 0 | Inquiry |
|
PA0029-S | Chip Quik, Inc. | QSOP-20 STENCIL | 11.59 | 0 | Inquiry |
SMD2SWLF.020 1OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
SMDSW.020 .4OZ
SOLDER WIRE POCKET PACK 63/37 TI
SMD2SW.020 .4OZ
SOLDER WIRE POCKET PACK 60/40 TI
PA0021-S
SSOP-30 STENCIL
PA0016-S
SSOP-14 STENCIL
PA0175-S
SOT-223-5 STENCIL
PA0224-S
SOP-40 STENCIL
PA0082-S
SC70-3/SOT-323 STENCIL
PA0031-S
QSOP-28 STENCIL
PA0029-S
QSOP-20 STENCIL