Lanka Micro
Chip Quik, Inc.
Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Image | Part Number | Manufacturers | Description | Unit Price($) | Stock | |
|---|---|---|---|---|---|---|
|
BGA0019-S | Chip Quik, Inc. | BGA-36 (0.4 MM PITCH, 6 X 6 GRID | 20.99 | 13 | Inquiry |
|
|
BGA0023-S | Chip Quik, Inc. | BGA-100 (0.4 MM PITCH, 10 X 10 G | 20.99 | 17 | Inquiry |
|
BGA0027-S | Chip Quik, Inc. | BGA-121 (0.65MM PITCH, 11 X 11 G | 20.99 | 22 | Inquiry |
|
SMDTCLF | Chip Quik, Inc. | SOLDER TIP TINNER (ACTIVATOR) | 7.65 | 28 | Inquiry |
|
BARSN96.5AG3.0CU0.5-8OZ | Chip Quik, Inc. | SOLDER BAR SN96.5/AG3.0/CU0.5 8O | 39.09 | 151 | Inquiry |
|
BARSN99.3CU0.7-8OZ | Chip Quik, Inc. | SOLDER BAR SN99.3/CU0.7 8OZ 227G | 20.85 | 115 | Inquiry |
|
BARSN63PB37-8OZ | Chip Quik, Inc. | SOLDER BAR SN63/PB37 8OZ 227G SU | 16.24 | 128 | Inquiry |
|
BARSN60PB40-8OZ | Chip Quik, Inc. | SOLDER BAR SN60/PB40 8OZ 227G SU | 13.57 | 180 | Inquiry |
|
SMDSWLF.031 2OZ | Chip Quik, Inc. | SLD WIRE NO-CLEAN 96.5/3/.5 2OZ. | 11.55 | 150 | Inquiry |
|
RASW.020 .4OZ | Chip Quik, Inc. | SOLDER WIRE POCKET PACK 63/37 TI | 5.81 | 127 | Inquiry |
BGA0019-S
BGA-36 (0.4 MM PITCH, 6 X 6 GRID
BGA0023-S
BGA-100 (0.4 MM PITCH, 10 X 10 G
BGA0027-S
BGA-121 (0.65MM PITCH, 11 X 11 G
SMDTCLF
SOLDER TIP TINNER (ACTIVATOR)
BARSN96.5AG3.0CU0.5-8OZ
SOLDER BAR SN96.5/AG3.0/CU0.5 8O
BARSN99.3CU0.7-8OZ
SOLDER BAR SN99.3/CU0.7 8OZ 227G
BARSN63PB37-8OZ
SOLDER BAR SN63/PB37 8OZ 227G SU
BARSN60PB40-8OZ
SOLDER BAR SN60/PB40 8OZ 227G SU
SMDSWLF.031 2OZ
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
RASW.020 .4OZ
SOLDER WIRE POCKET PACK 63/37 TI