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Chip Quik, Inc.

Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Image Part Number Manufacturers Description Unit Price($) Stock
NDR050P080-S NDR050P080-S Chip Quik, Inc. NARROW DUAL ROW 0.5MM PITCH 80-P 11.59 10 Inquiry
BGA0004-S BGA0004-S Chip Quik, Inc. STENCIL BGA-100 1MM 20.99 1 Inquiry
NDR040P040-S NDR040P040-S Chip Quik, Inc. NARROW DUAL ROW 0.4MM PITCH 40-P 11.59 10 Inquiry
BGA0006-S BGA0006-S Chip Quik, Inc. STENCIL BGA-484 1MM 20.99 1 Inquiry
BGA0009-S BGA0009-S Chip Quik, Inc. STENCIL BGA-484 1.27MM 20.99 1 Inquiry
BGA0001-S BGA0001-S Chip Quik, Inc. STENCIL BGA-100 .8MM 20.99 4 Inquiry
IPC0026-S IPC0026-S Chip Quik, Inc. QFN-40 STENCIL 11.59 2 Inquiry
PA0001-S PA0001-S Chip Quik, Inc. SOIC-8 STENCIL 11.59 2 Inquiry
PA0101-S PA0101-S Chip Quik, Inc. STENCIL LGA-14 3X5MM .8MM 11.59 2 Inquiry
PA0103-S PA0103-S Chip Quik, Inc. STENCIL LGA-16 .5MM 11.59 2 Inquiry

NDR050P080-S

NARROW DUAL ROW 0.5MM PITCH 80-P

BGA0004-S

STENCIL BGA-100 1MM

NDR040P040-S

NARROW DUAL ROW 0.4MM PITCH 40-P

BGA0006-S

STENCIL BGA-484 1MM

BGA0009-S

STENCIL BGA-484 1.27MM

BGA0001-S

STENCIL BGA-100 .8MM

IPC0026-S

QFN-40 STENCIL

PA0001-S

SOIC-8 STENCIL

PA0101-S

STENCIL LGA-14 3X5MM .8MM

PA0103-S

STENCIL LGA-16 .5MM