Lanka Micro
Chip Quik, Inc.
Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Image | Part Number | Manufacturers | Description | Unit Price($) | Stock | |
|---|---|---|---|---|---|---|
|
PA0067-S | Chip Quik, Inc. | QFN-32 STENCIL | 11.59 | 0 | Inquiry |
|
IPC0018-S | Chip Quik, Inc. | QFN-28 STENCIL | 11.59 | 0 | Inquiry |
|
PA0005-S | Chip Quik, Inc. | SOIC-16 STENCIL | 11.59 | 0 | Inquiry |
|
PA0085-S | Chip Quik, Inc. | SOT23-6/SC59-6 STENCIL | 11.59 | 0 | Inquiry |
|
SMD2SW.031 .7OZ | Chip Quik, Inc. | SOLDER WIRE POCKET PACK 60/40 TI | 4.49 | 54 | Inquiry |
|
RASW.031 .7OZ | Chip Quik, Inc. | SOLDER WIRE POCKET PACK 63/37 TI | 4.45 | 55 | Inquiry |
|
SMD291AX250T5 | Chip Quik, Inc. | SOLDER PASTE SN63/PB37 250G T5 | 90.95 | 4 | Inquiry |
|
TS391LT250 | Chip Quik, Inc. | THERMALLY STABLE SOLDER PASTE NO | 84.95 | 12 | Inquiry |
|
SMDSWLF.006 50G | Chip Quik, Inc. | LF SOLDER WIRE 96.5/3/0.5 TIN/SI | 79.99 | 13 | Inquiry |
|
SMDSWLF.008 50G | Chip Quik, Inc. | LF SOLDER WIRE 96.5/3/0.5 TIN/SI | 71.99 | 12 | Inquiry |
PA0067-S
QFN-32 STENCIL
IPC0018-S
QFN-28 STENCIL
PA0005-S
SOIC-16 STENCIL
PA0085-S
SOT23-6/SC59-6 STENCIL
SMD2SW.031 .7OZ
SOLDER WIRE POCKET PACK 60/40 TI
RASW.031 .7OZ
SOLDER WIRE POCKET PACK 63/37 TI
SMD291AX250T5
SOLDER PASTE SN63/PB37 250G T5
TS391LT250
THERMALLY STABLE SOLDER PASTE NO
SMDSWLF.006 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
SMDSWLF.008 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI